Electric
Electric
FIBER-EMBEDDING UNIT FOR THREE-DIMENSIONAL (3D) PRINTING SYSTEMS
13/03/2025 -
A three-dimensional (3D) printing system may comprise a frame; and an additive component(s) configured to couple to the frame. The additive component(s) may comprise a first extrusion unit, a...
FIBER-EMBEDDING UNIT FOR THREE-DIMENSIONAL (3D) PRINTING SYSTEMS
13/03/2025 -
A three-dimensional (3D) printing system may comprise a frame; and an additive component(s) configured to couple to the frame. The additive component(s) may comprise a first extrusion unit, a...
STAINLESS STEEL POLYMER ADHESION LAYER
13/03/2025 -
A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to stainless steel surfaces. This process forms an oxide layer...
Self-centering polymeric washer that prevents misalignment when positioned between a feedthrough and a circuit board supporting EMI filter capacitors for a medical device
11/03/2025 -
A self-centering washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner...
SILICONE COMPOSITION, HEAT DISSIPATION MEMBER, AND ELECTRONIC DEVICE
21/02/2025 -
(a) 특정의 오르가노폴리실록산과, (b) 분자쇄 양 말단과 측쇄 양쪽 모두에 Si-H를 갖고, 또한 분자쇄 측쇄의 Si-H가 4∼15개인...
ADHESIVE COMPOSITION FOR LIGHT IRRADIATION PEELING, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE OR ELECTRONIC DEVICE LAYER
21/02/2025 -
본 발명은, 1층으로 접착 기능도 박리 기능도 갖는, 광 조사에 의해 박리 가능한 접착제층을 갖는 적층체로서, 반도체 기판 또는 전자 디바이스층의...
SILICONE COMPOSITION, HEAT DISSIPATING MEMBER, AND ELECTRONIC APPARATUS
21/02/2025 -
(a) 1분자 중에 적어도 2개의 알케닐기를 갖는 오르가노폴리실록산과, (b1) 분자쇄 양 말단 및 분자쇄 측쇄 양쪽 모두에 규소 원자에 직접 결합한 수소...
CONDUCTIVE PASTE, ELECTRONIC COMPONENT AND MULTILAYER CERAMIC CAPACITOR
21/02/2025 -
적층 세라믹 전자 부품의 소형화, 박형화를 위해서 미세화한 도전성 분말이나 세라믹 분말을 사용한 도전성 페이스트에 있어서, 평활한 건조막을...
ELECTRONIC DEVICE SEALING COMPOSITION, ELECTRONIC DEVICE SEALING FILM, AND METHOD FOR FORMING ELECTRONIC DEVICE SEALING FILM
21/02/2025 -
본 발명의 전자 디바이스 봉지용 조성물은, 광중합성 모노머 및 광중합 개시제를 함유하는 전자 디바이스 봉지용 조성물로서, 상기 광중합성...
ADDITIVE MANUFACTURING OF STANDOFFS BETWEEN INTEGRATED CIRCUIT AND PRINTED CIRCUIT BOARD
06/03/2025 -
A method of attaching a chip and a printed circuit board, comprises additively manufacturing an array of conductive standoffs onto conductive pads on a surface of the chip, and connecting the...
MOLDED PRODUCT FORMATION METHOD AND SEALING RESIN
06/03/2025 -
The present invention addresses the problem of providing a molded product formation method which makes it possible to: provide a compression molding device and a compression molding method that...
PLASTIC LENS MANUFACTURING METHOD, PLASTIC LENS AND ELECTRONIC DEVICE
06/03/2025 -
A plastic lens manufacturing method, a plastic lens and an electronic device are disclosed. The plastic lens manufacturing method may comprise the steps of: heating a lens; cooling the heated...
Broad-Spectrum HC/VOC Getter for Emission Control in Electronics
06/03/2025 -
Getters for hydrocarbons (HCs) and volatile organic compounds (VOCs) designed for microelectronic and electronic packages are disclosed. These getters feature a hierarchical porous nanostructured...
THERMOELECTRIC CHARGERS EMBEDDED IN THERMALLY INSULATED CONTAINERS AND METHODS OF CHARGING ELECTRONIC DEVICES USING THE SAME
27/02/2025 -
The present disclosure provides a thermoelectric charger that includes at least one thermoelectric generator embedded within at least one surface of a thermally insulated container as well as...
INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, RECORDING MEDIUM, INFORMATION PROCESSING DEVICE, AND PROCESSING DEVICE
20/02/2025 -
This information processing method includes: acquiring a difference model indicating a difference between an object model obtained by measuring a three-dimensional shape of an object and a target...
RESIN MOLDING DEVICE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
20/02/2025 -
A resin molding device according to the present invention comprises: a first mold that is capable of placing a substrate on which an electronic element is mounted; a second mold for forming a...
HOUSING AND ELECTRONIC DEVICE
20/02/2025 -
Provided in the present application are a housing and an electronic device. The housing comprises a frame body and a plastic covering. A first mounting frame of the frame body is provided with a...
PROCESS AND SYSTEM FOR CONVERTING PLASTIC MATERIAL INTO LIQUIFIED PETROLEUM PRODUCTS
20/02/2025 -
The present invention provides a process for converting plastic material into liquified petroleum products. The process includes feeding the material into at least one thermolysis reactor of a...
ELECTRONIC DEVICE COMPRISING SELF-HEALING PROTECTIVE LAYER
20/02/2025 -
The present disclosure relates to a protective layer having self-healing characteristics and shape memory characteristics on one surface of a display panel. To this end, the protective layer can...
Dual Electron Donating MetalâBoron Reaction Center Boosts Electrocatalytic Urea Synthesis from N2 and CO2
24/10/2024 -
Polymers synthesized by solid-phase synthesis are selectively released from a solid support by reversing the bias of spatially addressable electrodes. Change in the current and voltage direction...
HOME APPLIANCE COMPRISING OPTICAL SENSOR
13/02/2025 -
This refrigerator may comprise: a main body including a storage chamber; a door rotatably connected to the main body; a water container mounting unit disposed on the door; a water container that...
