Materials
Materials
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REACTIVE SURFACTANTS
18/09/2024 -
Processes for making reactive surfactants are disclosed. In one such process, an alkyl- or alkenylsuccinic anhydride is reacted with an olefin-functional nucleophile to produce an...
REACTIVE SURFACTANTS
18/09/2024 -
Processes for making reactive surfactants are disclosed. In one such process, an alkyl- or alkenylsuccinic anhydride is reacted with an olefin-functional nucleophile to produce an...
AZO-LINKED ORGANIC POLYMERS FOR CARBON DIOXIDE CAPTURE AND METAL ION REMOVAL
12/09/2024 -
A polymer including reacted units of 1,3,5-trihydroxybenzene and a compound A represented by Formula (I) below,in Formula (I), n=0-5. Compound A is bonded to the 1,3,5-trihydroxybenzene through an...
HIGH PRESSURE DEPOLYMERIZATION OF HDPE AND PP
12/09/2024 -
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LIQUID CRYSTAL COMPOUNDS
10/09/2024 -
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PROCESS FOR PREPARING A CARBON FIBER PRECURSOR
12/09/2024 -
A process for preparing a carbon fiber precursor wherein the precursor is selected from a series of solid PAN (polyacrylonitrile) fibers, wherein each member of the series contains about 2 weight...
HEAT-EXPANDABLE MICROSPHERES AND USE THEREOF
12/09/2024 -
The purpose of the present invention is to provide heat-expandable microspheres capable of yielding a molded article that does not tend to deform over the long term, and the use of the...
RESIN MODIFIER AND RESIN COMPOSITION COMPRISING SAME
12/09/2024 -
Provided is a resin modifier that can be added to general resins to improve mechanical strength of molded articles and can be mixed without deteriorating appearances and thus is expected to...
TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER PROCESSED BODY, AND METHOD FOR MANUFACTURING THIN WAFER
12/09/2024 -
The present invention is a temporary adhesive for wafer processing for temporarily bonding, to a support, a wafer that has a circuit-forming surface on a front surface and has a rear surface to be...
DIBENZOTHIOPHENE-SUBSTITUTED AROMATIC COMPOUNDS AND THERMOPLASTIC RESINS PREPARED THEREFROM
12/09/2024 -
The present invention relates to the use of a compound of the formula (I) where X1 and X2, independently of each other, are a bond or C1—C5—aIkanediyI; Z1 and Z2, independently of each other,...
